SpletFig.1 HAST試験装置イメージ図 ※二層式試験装置は、試験槽と加湿槽が独立した構造であるため、一槽式に比べ広い槽内寸法の確保が可能です。 また、試験槽(乾球)と加湿槽(湿球)間で及ぼしあう温度影響が少ないので高精度制御が可能と言われていますが ... SpletSehen Sie sich das Profil von Daniela J. im größten Business-Netzwerk der Welt an. Im Profil von Daniela J. ist 1 Job angegeben. Auf LinkedIn können Sie sich das vollständige Profil ansehen und mehr über die Kontakte von Daniela J. und Jobs bei ähnlichen Unternehmen erfahren.
PCB的HAST测试条件以及HAST加速寿命模式
HAST and burn-In Board (BIB) test sockets allow for fast and reliable connection and change out of semiconductor devices to fulfill burn-in, humidity, failure analysis, and test requirements for Leaded, LGA and BGA packages. There are multiple manufacturers of board test sockets that offer both through-hole … Prikaži več The design team at KEShas decades of experience selecting the right components for your board design. Using our HAST board design guidelines is an important first step toward … Prikaži več Temperature derating is a critical parameter to consider when selecting components including capacitors and resistors for use in board applications. For tantalum capacitors, voltage and capacitance derating … Prikaži več PCB laminate selection is an important consideration for your HAST board. Many different laminate materials are available to support the requirements of your project. When selecting the laminate for your PCB board, … Prikaži več On HAST and THB type boards, Cathode Anode Filament (CAF) and Electrochemical Migration (ECM) is metal migration between isolated conductors on a completed printed circuit assembly may produce electrical … Prikaži več SpletThe Highly Accelerated Stress Test (HAST) combines high temperature, high humidity, high pressure and time to measure component reliability with or without electrical bias. In a … navy federal credit union smokey point
HAST高加速应力测试介绍 - 知乎
http://www.gtscert.com/news/21967.html Splet溫溼度試驗(Temperature with Humidity),是藉由高溫、高濕、高壓的加速因子下,驗證評估非密封性包裝之電子零組件中,封裝材質與內部線路對濕氣腐蝕抵抗的能力,針對消費 … Splet溫溼度試驗(Temperature with Humidity),是藉由高溫、高濕、高壓的加速因子下,驗證評估非密封性包裝之電子零組件中,封裝材質與內部線路對濕氣腐蝕抵抗的能力,針對消費性零件,JEDEC 定義測試條件包括,THB、 HAST、uHAST、PCT。 mark of eviction